Issued Patents 2020
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10872849 | Tapeless leadframe package with underside resin and solder contact | — | 2020-12-22 |
| 10840168 | Leadframe package with side solder ball contact and method of manufacturing | Tito Mangaoang | 2020-11-17 |
| 10672689 | Protection from ESD during the manufacturing process of semiconductor chips | Frederick Ray Gomez, Tito Mangaoang | 2020-06-02 |
| 10615104 | Modified leadframe design with adhesive overflow recesses | Rennier Rodriguez, Aiza Marie Agudon, Moonlord Manalo, Ela Mia Cadag, Rammil Seguido | 2020-04-07 |
| 10535588 | Die with metallized sidewall and method of manufacturing | Rennier Rodriguez, Aiza Marie Agudon | 2020-01-14 |