Issued Patents 2020
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10796984 | Leadframe having a conductive layer protruding through a lead recess | Raymond Albert Narvadez, Ernesto Antilano, Jr. | 2020-10-06 |
| 10763194 | Package with lead frame with improved lead design for discrete electrical components and manufacturing the same | Bryan Christian Bacquian, Maiden Grace Maming, David Gani | 2020-09-01 |
| 10615104 | Modified leadframe design with adhesive overflow recesses | Aiza Marie Agudon, Jefferson Talledo, Moonlord Manalo, Ela Mia Cadag, Rammil Seguido | 2020-04-07 |
| 10535588 | Die with metallized sidewall and method of manufacturing | Aiza Marie Agudon, Jefferson Talledo | 2020-01-14 |