Issued Patents 2020
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10840168 | Leadframe package with side solder ball contact and method of manufacturing | Jefferson Talledo | 2020-11-17 |
| 10672689 | Protection from ESD during the manufacturing process of semiconductor chips | Frederick Ray Gomez, Jefferson Talledo | 2020-06-02 |