Issued Patents 2020
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10797024 | System-in-package with double-sided molding | DeokKyung Yang, Yongmin Kim, Jaehyuk Choi, HeeSoo Lee | 2020-10-06 |
| 10636765 | System-in-package with double-sided molding | DeokKyung Yang, Yongmin Kim, Jaehyuk Choi, HeeSoo Lee | 2020-04-28 |