Issued Patents 2020
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10840171 | Integrated circuit package including inward bent leads | Michael L. Meyers, Scott F. Eisenhart, Richard J. Saye | 2020-11-17 |
| 10832991 | Leadless packaged device with metal die attach | Benjamin Stassen Cook, Nazila Dadvand | 2020-11-10 |
| 10832993 | Packaged multichip device with stacked die having a metal die attach | Nazila Dadvand, Benjamin Stassen Cook | 2020-11-10 |
| 10734313 | Integration of a passive component in an integrated circuit package | Jeffrey Anthony Morroni, Rajeev Joshi, Sujan Kundapur Manohar, Yogesh Kumar Ramadass, Anindya Poddar | 2020-08-04 |
| 10658278 | Electrical device terminal finishing | — | 2020-05-19 |
| 10643929 | Cantilevered leadframe support structure for magnetic wireless transfer between integrated circuit dies | Benjamin Michael Sutton, Subhashish Mukherjee | 2020-05-05 |
| 10636758 | Expanded head pillar for bump bonds | — | 2020-04-28 |