Issued Patents 2020
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10854370 | Embedded coil assembly and method of making | Haiying Li, Ming Li | 2020-12-01 |
| 10643929 | Cantilevered leadframe support structure for magnetic wireless transfer between integrated circuit dies | Sreenivasan K. Koduri, Subhashish Mukherjee | 2020-05-05 |