| 10854712 |
Isolation of circuit elements using front side deep trench etch |
Dan Carothers, Rajarshi Mukhopadhyay, Ben Cook |
2020-12-01 |
| 10840179 |
Electronic devices with bond pads formed on a molybdenum layer |
Ting-Ta Yen, Brian E. Goodlin |
2020-11-17 |
| 10829365 |
Piezoelectric optical MEMS device with embedded moisture layers |
YungShan Chang |
2020-11-10 |
| 10770406 |
Methods and apparatus for scribe street pads with reduced die chipping during wafer dicing |
Erika Lynn Mazotti, Sudtida Lavangkul |
2020-09-08 |
| 10705159 |
Highly sensitive, low power fluxgate magnetic sensor integrated onto semiconductor process technologies |
Erika Lynn Mazotti, Dok Won Lee, William French, Byron J.R. Shulver, Thomas D. Bonifield +1 more |
2020-07-07 |
| 10651817 |
Bulk acoustic wave resonator on a stress isolated platform |
Ting-Ta Yen, Brian E. Goodlin, Nicholas Stephen Dellas |
2020-05-12 |
| 10574184 |
Stacked-die bulk acoustic wave oscillator package |
Kurt Peter Wachtler |
2020-02-25 |
| 10570006 |
Infrared sensor design using an epoxy film as an infrared absorption layer |
Walter B. Meinel, Kalin V. Lazarov, Brian E. Goodlin |
2020-02-25 |
| 10526198 |
Infrared sensor design using an epoxy film as an infrared absorption layer |
Walter B. Meinel, Kalin V. Lazarov, Brian E. Goodlin |
2020-01-07 |