Issued Patents 2020
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10770406 | Methods and apparatus for scribe street pads with reduced die chipping during wafer dicing | Ricky Alan Jackson, Sudtida Lavangkul | 2020-09-08 |
| 10705159 | Highly sensitive, low power fluxgate magnetic sensor integrated onto semiconductor process technologies | Dok Won Lee, William French, Byron J.R. Shulver, Thomas D. Bonifield, Ricky Alan Jackson +1 more | 2020-07-07 |