Issued Patents 2020
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10854757 | FINFET based junctionless wrap around structure | Hsu-Yu Chang, Chia-Hong Jan, Walid M. Hafez, Neville L. Dias, Roman W. Olac-Vaw +1 more | 2020-12-01 |
| 10811751 | Monolithic splitter using re-entrant poly silicon waveguides | Chia-Hong Jan, Walid M. Hafez, Neville L. Dias, Hsu-Yu Chang, Roman W. Olac-Vaw +1 more | 2020-10-20 |
| 10761264 | Transmission lines using bending fins from local stress | Chia-Hong Jan, Walid M. Hafez, Neville L. Dias, Hsu-Yu Chang, Roman W. Olac-Vaw +1 more | 2020-09-01 |
| 10763209 | MOS antifuse with void-accelerated breakdown | Roman W. Olac-Vaw, Walid M. Hafez, Chia-Hong Jan, Hsu-Yu Chang, Ting Chang +2 more | 2020-09-01 |
| 10756210 | Depletion mode gate in ultrathin FINFET based architecture | Chia-Hong Jan, Walid M. Hafez, Hsu-Yu Chang, Neville L. Dias, Roman W. Olac-Vaw +1 more | 2020-08-25 |