Issued Patents 2020
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10840192 | Stacked silicon package assembly having enhanced stiffener | Nael Zohni, Shin S. Low, Inderjit Singh, Ganesh Hariharan | 2020-11-17 |
| 10638608 | Interconnect frames for SIP modules | Lan H. Hoang, Chang Liu, Takayoshi Katahira | 2020-04-28 |
| 10602612 | Vertical module and perpendicular pin array interconnect for stacked circuit board structure | Lan H. Hoang, Takayoshi Katahira, Leilei Zhang | 2020-03-24 |