Issued Patents 2020
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10638608 | Interconnect frames for SIP modules | Lan H. Hoang, Raghunandan Chaware, Chang Liu | 2020-04-28 |
| 10624214 | Low-profile space-efficient shielding for SIP module | Amir Salehi, Vu T. Vo, Wyeman Chen, Chang Liu, Dennis R. Pyper +4 more | 2020-04-14 |
| 10602612 | Vertical module and perpendicular pin array interconnect for stacked circuit board structure | Lan H. Hoang, Leilei Zhang, Raghunandan Chaware | 2020-03-24 |