Issued Patents 2020
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10631410 | Stacked printed circuit board packages | Corey S. Provencher, Meng Chi Lee, Derek Walters, Ian A. Spraggs, Flynn Carson +9 more | 2020-04-21 |
| 10624214 | Low-profile space-efficient shielding for SIP module | Amir Salehi, Takayoshi Katahira, Vu T. Vo, Wyeman Chen, Chang Liu +4 more | 2020-04-14 |