Issued Patents 2020
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10709018 | System-in-package including opposing circuit boards | Yanfeng Chen, Shankar S. Pennathur, Mandar Painaik, Meng Chi Lee | 2020-07-07 |
| 10701802 | Electrical components attached to fabric | Daniel D. Sunshine, David M. Kindlon, Michael B. Nussbaum, Andrew L. Rosenberg, Andrew Sterian +7 more | 2020-06-30 |
| 10638608 | Interconnect frames for SIP modules | Raghunandan Chaware, Chang Liu, Takayoshi Katahira | 2020-04-28 |
| 10624214 | Low-profile space-efficient shielding for SIP module | Amir Salehi, Takayoshi Katahira, Vu T. Vo, Wyeman Chen, Chang Liu +4 more | 2020-04-14 |
| 10602612 | Vertical module and perpendicular pin array interconnect for stacked circuit board structure | Takayoshi Katahira, Leilei Zhang, Raghunandan Chaware | 2020-03-24 |