Issued Patents 2020
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10840192 | Stacked silicon package assembly having enhanced stiffener | Nael Zohni, Shin S. Low, Raghunandan Chaware, Ganesh Hariharan | 2020-11-17 |
| 10764996 | Chip package assembly with composite stiffener | Ronilo Boja | 2020-09-01 |
| 10607156 | Federated systems and methods for medical data sharing | Kai-How Farh, Donavan Cheng, John Casey Shon, Jorg Hakenberg, Eugene Bolotin +5 more | 2020-03-31 |