Issued Patents 2020
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10854575 | Three-dimensional (3D) package structure having an epoxy molding compound layer between a discrete inductor and an encapsulating connecting structure | Bau-Ru Lu, Shao-Wei Lu | 2020-12-01 |
| 10529680 | Encapsulated electronic device mounted on a redistribution layer | Bau-Ru Lu | 2020-01-07 |