Issued Patents 2020
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10854575 | Three-dimensional (3D) package structure having an epoxy molding compound layer between a discrete inductor and an encapsulating connecting structure | Ming-Chia Wu, Shao-Wei Lu | 2020-12-01 |
| 10856417 | Power supply module used in a smart terminal and power supply module assembly structure | Pengkai Ji, Jianhong Zeng, Yu Zhang, Shouyu Hong, Jinping Zhou | 2020-12-01 |
| 10741531 | Method to form a stacked electronic structure | Chi-Feng Huang, Da-Jung Chen | 2020-08-11 |
| 10636735 | Package structure and the method to fabricate thereof | Jeng-Jen Li, Kaipeng Chiang | 2020-04-28 |
| 10593561 | Stack frame for electrical connections and the method to fabricate thereof | Da-Jung Chen, Yi-Cheng Lin | 2020-03-17 |
| 10529680 | Encapsulated electronic device mounted on a redistribution layer | Ming-Chia Wu | 2020-01-07 |