Issued Patents 2020
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10854575 | Three-dimensional (3D) package structure having an epoxy molding compound layer between a discrete inductor and an encapsulating connecting structure | Bau-Ru Lu, Ming-Chia Wu | 2020-12-01 |