Issued Patents 2020
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10797035 | Bonded assembly containing side bonding structures and methods of manufacturing the same | Takashi Yamaha, Koichi Ito, Ikue Yokomizo, Ryo Hiramatsu, Kazuto Watanabe +3 more | 2020-10-06 |
| 10790296 | Distortion-compensated wafer bonding method and apparatus using a temperature-controlled backside thermal expansion layer | Takashi Yamaha, Katsuya Kato, Kazuto Watanabe, Hajime Yamamoto, Koichi Ito +3 more | 2020-09-29 |
| 10756106 | Three-dimensional memory device with locally modulated threshold voltages at drain select levels and methods of making the same | Masatoshi Nishikawa, Ken Oowada, Zhixin Cui | 2020-08-25 |
| 10553599 | Three-dimensional memory device containing drain select isolation structures and on-pitch channels and methods of making the same without an etch stop layer | Zhen Chen, Mitsuteru Mushiga | 2020-02-04 |