Issued Patents 2020
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10827920 | OCT apparatus | — | 2020-11-10 |
| 10797035 | Bonded assembly containing side bonding structures and methods of manufacturing the same | Michiaki Sano, Takashi Yamaha, Ikue Yokomizo, Ryo Hiramatsu, Kazuto Watanabe +3 more | 2020-10-06 |
| 10790296 | Distortion-compensated wafer bonding method and apparatus using a temperature-controlled backside thermal expansion layer | Takashi Yamaha, Katsuya Kato, Kazuto Watanabe, Hajime Yamamoto, Michiaki Sano +3 more | 2020-09-29 |
| 10752078 | Heat transfer device | Koji Ito | 2020-08-25 |
| 10659629 | Information processing apparatus including a plurality of network interfaces and control method thereof | — | 2020-05-19 |