Issued Patents 2020
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10797035 | Bonded assembly containing side bonding structures and methods of manufacturing the same | Michiaki Sano, Koichi Ito, Ikue Yokomizo, Ryo Hiramatsu, Kazuto Watanabe +3 more | 2020-10-06 |
| 10790296 | Distortion-compensated wafer bonding method and apparatus using a temperature-controlled backside thermal expansion layer | Katsuya Kato, Kazuto Watanabe, Hajime Yamamoto, Michiaki Sano, Koichi Ito +3 more | 2020-09-29 |