Issued Patents 2020
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10685850 | High density organic interconnect structures | Sri Chaitra Jyotsna Chavali, Siddharth K. Alur, Amanda E. Schuckman | 2020-06-16 |
| 10573622 | Methods of forming joint structures for surface mount packages | Edward R. Prack | 2020-02-25 |