Issued Patents 2020
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10661383 | Mitigation of particle contamination for wafer dicing processes | Wei-Sheng Lei, Ajay Kumar, Brad Eaton | 2020-05-26 |
| 10535561 | Hybrid wafer dicing approach using a multiple pass laser scribing process and plasma etch process | James S. Papanu, Ajay Kumar, Wei-Sheng Lei | 2020-01-14 |