Issued Patents 2020
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10714390 | Wafer dicing using femtosecond-based laser and plasma etch | Brad Eaton, Madhava Rao Yalamanchili, Saravjeet Singh, Ajay Kumar, James M. Holden | 2020-07-14 |
| 10661383 | Mitigation of particle contamination for wafer dicing processes | Jungrae Park, Ajay Kumar, Brad Eaton | 2020-05-26 |
| 10566238 | Wafer dicing using femtosecond-based laser and plasma etch | Brad Eaton, Madhava Rao Yalamanchili, Saravjeet Singh, Ajay Kumar, James M. Holden | 2020-02-18 |
| 10535561 | Hybrid wafer dicing approach using a multiple pass laser scribing process and plasma etch process | Jungrae Park, James S. Papanu, Ajay Kumar | 2020-01-14 |