Issued Patents 2020
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10535561 | Hybrid wafer dicing approach using a multiple pass laser scribing process and plasma etch process | Jungrae Park, Ajay Kumar, Wei-Sheng Lei | 2020-01-14 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10535561 | Hybrid wafer dicing approach using a multiple pass laser scribing process and plasma etch process | Jungrae Park, Ajay Kumar, Wei-Sheng Lei | 2020-01-14 |