Issued Patents 2020
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10867984 | Method of manufacturing a package-on-package type semiconductor package | Dong Jin Kim, Jin Han Kim, Se Woong Cha, Ji Hun Lee, Yeong Beom Ko | 2020-12-15 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10867984 | Method of manufacturing a package-on-package type semiconductor package | Dong Jin Kim, Jin Han Kim, Se Woong Cha, Ji Hun Lee, Yeong Beom Ko | 2020-12-15 |