Issued Patents 2020
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10867984 | Method of manufacturing a package-on-package type semiconductor package | Dong Jin Kim, Jin Han Kim, Ji Hun Lee, Joon Dong Kim, Yeong Beom Ko | 2020-12-15 |
| 10784178 | Wafer-level stack chip package and method of manufacturing the same | Yeong Beom Ko, Dong Jin Kim | 2020-09-22 |
| 10692918 | Electronic device package and fabricating method thereof | Jin Young Kim, No Sun Park, Yoon Joo Kim, Seung Jae Lee, Sung Kyu Kim +1 more | 2020-06-23 |
| 10672699 | Semiconductor device with redistribution layers on partial encapsulation and non-photosensitive passivation layers | Jong Sik Paek, Jin Young Kim, YoonJoo Kim, Jin Han Kim, Seungjae Lee +4 more | 2020-06-02 |