Issued Patents 2020
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10867984 | Method of manufacturing a package-on-package type semiconductor package | Dong Jin Kim, Jin Han Kim, Se Woong Cha, Ji Hun Lee, Joon Dong Kim | 2020-12-15 |
| 10784178 | Wafer-level stack chip package and method of manufacturing the same | Dong Jin Kim, Se Woong Cha | 2020-09-22 |