Issued Patents 2020
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10714390 | Wafer dicing using femtosecond-based laser and plasma etch | Wei-Sheng Lei, Brad Eaton, Madhava Rao Yalamanchili, Saravjeet Singh, Ajay Kumar | 2020-07-14 |
| 10692765 | Transfer arm for film frame substrate handling during plasma singulation of wafers | Alexander Lerner, Ajay Kumar, Brad Eaton, Aparna Iyer | 2020-06-23 |
| 10566238 | Wafer dicing using femtosecond-based laser and plasma etch | Wei-Sheng Lei, Brad Eaton, Madhava Rao Yalamanchili, Saravjeet Singh, Ajay Kumar | 2020-02-18 |