Issued Patents 2020
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10784211 | Semiconductor package structure | Tzu-Hung Lin, Chia-Cheng Chang, Nai-Wei Liu | 2020-09-22 |
| 10692789 | Stacked fan-out package structure | Nai-Wei Liu, Tzu-Hung Lin, Ching-Wen Hsiao, Wei-Che Huang | 2020-06-23 |