Issued Patents 2020
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10863017 | Apparatus and method for automatic call receiving and sending depending on user posture in portable terminal | Tae-Jun Park | 2020-12-08 |
| 10847450 | Compact wirebonding in stacked-chip system in package, and methods of making same | Saeed S. Shojaie, Bilal Khalaf, Min-Tih Lai | 2020-11-24 |
| 10790257 | Active package substrate having anisotropic conductive layer | Juan E. Dominguez | 2020-09-29 |
| 10777486 | Substrate-free system in package design | — | 2020-09-15 |
| 10727220 | Package on package with integrated passive electronics method and apparatus | — | 2020-07-28 |
| 10573575 | Semiconductor package with thermal fins | Florence R. Pon, Yi Xu, Yuhong Cai, Min-Tih Lai, Leo Craft | 2020-02-25 |