Issued Patents 2020
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10847442 | Interconnect assemblies with through-silicon vias and stress-relief features | Anurag Jindal, Jin Lu, Gowrisankar Damarla, Shyam Ramalingam | 2020-11-24 |
| 10825987 | Fabrication of electrodes for memory cells | Pengyuan Zheng, Yongjun Jeff Hu, Yao Jin, Andrea Gotti | 2020-11-03 |
| 10543579 | Polishing apparatuses and polishing methods | Jian Zhou, James A. Cultra | 2020-01-28 |
| 10546777 | Conductive interconnect structures incorporating negative thermal expansion materials and associated systems, devices, and methods | Anurag Jindal, Jin Lu, Shyam Ramalingam | 2020-01-28 |