Issued Patents 2020
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10854549 | Redistribution layers with carbon-based conductive elements, methods of fabrication and related semiconductor device packages and systems | — | 2020-12-01 |
| 10797018 | Methods for fabricating 3D semiconductor device packages, resulting packages and systems incorporating such packages | — | 2020-10-06 |
| 10651050 | Semiconductor device packages and structures | — | 2020-05-12 |
| 10600770 | Semiconductor dice assemblies, packages and systems, and methods of operation | Shiro Uchiyama | 2020-03-24 |
| 10580720 | Silicon interposer with fuse-selectable routing array | Bret K. Street, Owen R. Fay | 2020-03-03 |
| 10529659 | Semiconductor devices having electrically and optically conductive vias, and associated systems and methods | Mark E. Tuttle | 2020-01-07 |