Issued Patents 2020
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10607860 | Package structure and chip structure | Li-Chih Fang, Ji-Cheng Lin, Che-Min Chu, Chun-Te Lin | 2020-03-31 |
| 10593629 | Semiconductor package with a conductive casing for heat dissipation and electromagnetic interference (EMI) shield and manufacturing method thereof | Li-Chih Fang, Wen-Jeng Fan | 2020-03-17 |