Issued Patents 2020
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10714390 | Wafer dicing using femtosecond-based laser and plasma etch | Wei-Sheng Lei, Madhava Rao Yalamanchili, Saravjeet Singh, Ajay Kumar, James M. Holden | 2020-07-14 |
| 10692765 | Transfer arm for film frame substrate handling during plasma singulation of wafers | James M. Holden, Alexander Lerner, Ajay Kumar, Aparna Iyer | 2020-06-23 |
| 10661383 | Mitigation of particle contamination for wafer dicing processes | Wei-Sheng Lei, Jungrae Park, Ajay Kumar | 2020-05-26 |
| 10566238 | Wafer dicing using femtosecond-based laser and plasma etch | Wei-Sheng Lei, Madhava Rao Yalamanchili, Saravjeet Singh, Ajay Kumar, James M. Holden | 2020-02-18 |