Issued Patents 2020
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10879152 | Through mold via (TMV) using stacked modular mold rings | Yi Xu | 2020-12-29 |
| 10847450 | Compact wirebonding in stacked-chip system in package, and methods of making same | Saeed S. Shojaie, Hyoung Il Kim, Min-Tih Lai | 2020-11-24 |