Issued Patents 2020
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10636700 | Metal via processing schemes with via critical dimension (CD) control for back end of line (BEOL) interconnects and the resulting structures | Paul A. Nyhus, Charles H. Wallace, Robert M. Bigwood, Deepak S. Rao, Alexander F. Kaplan | 2020-04-28 |