HT

Hong Hock Tay

Infineon Technologies Ag: 1 patents #355 of 900Top 40%
📍 Muar, MY: #4 of 5 inventorsTop 80%
Overall (2020): #445,949 of 565,922Top 80%
1
Patents 2020

Issued Patents 2020

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
10770399 Semiconductor package having a filled conductive cavity Chee Yang Ng, Hock Siang Chua, Stefan Macheiner, Josef Maerz, Nurfarena Othman +1 more 2020-09-08