Issued Patents 2020
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10700013 | IC wafer for identification of circuit dies after dicing | Wen Liu, Sebastian T. Ventrone, Adam C. Smith, Nazmul Habib | 2020-06-30 |
JA
Janice M. Adams
Overall (2020): #437,821 of 565,922Top 80%
1
Patents 2020