Issued Patents 2020
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10700013 | IC wafer for identification of circuit dies after dicing | Wen Liu, Sebastian T. Ventrone, Janice M. Adams, Nazmul Habib | 2020-06-30 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10700013 | IC wafer for identification of circuit dies after dicing | Wen Liu, Sebastian T. Ventrone, Janice M. Adams, Nazmul Habib | 2020-06-30 |