Issued Patents 2020
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10804189 | Power device package structure | — | 2020-10-13 |
| 10741644 | Semiconductor devices with via structure and package structures comprising the same | Shiau-Shi Lin, Tzu-Hsuan Cheng | 2020-08-11 |
| 10685904 | Packaging device and manufacturing method thereof | Chia-Yen Lee, Peng-Hsin Lee | 2020-06-16 |