Issued Patents 2020
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10741644 | Semiconductor devices with via structure and package structures comprising the same | Tzu-Hsuan Cheng, Hsin-Chang Tsai | 2020-08-11 |
| 10573618 | Package structures and methods for fabricating the same | — | 2020-02-25 |