Issued Patents 2020
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10872848 | Semiconductor package with leadframe interconnection structure | Woon Yik Yong, Andreas Kucher, Shao Ping Wan | 2020-12-22 |
| 10685904 | Packaging device and manufacturing method thereof | Hsin-Chang Tsai, Peng-Hsin Lee | 2020-06-16 |