Issued Patents 2020
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10872848 | Semiconductor package with leadframe interconnection structure | Woon Yik Yong, Chia-Yen Lee, Shao Ping Wan | 2020-12-22 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10872848 | Semiconductor package with leadframe interconnection structure | Woon Yik Yong, Chia-Yen Lee, Shao Ping Wan | 2020-12-22 |