Issued Patents 2020
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10818635 | Fully molded semiconductor package for power devices and method of making the same | Timothy L. Olson | 2020-10-27 |
| 10720417 | Thermally enhanced fully molded fan-out module | — | 2020-07-21 |
| 10672624 | Method of making fully molded peripheral package on package device | William Boyd Rogers, Craig Bishop | 2020-06-02 |
| 10573601 | Semiconductor device and method of unit specific progressive alignment | Craig Bishop | 2020-02-25 |