Issued Patents 2020
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10672624 | Method of making fully molded peripheral package on package device | Christopher M. Scanlan, William Boyd Rogers | 2020-06-02 |
| 10573601 | Semiconductor device and method of unit specific progressive alignment | Christopher M. Scanlan | 2020-02-25 |