Issued Patents 2020
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10818635 | Fully molded semiconductor package for power devices and method of making the same | Christopher M. Scanlan | 2020-10-27 |
| 10600652 | Semiconductor device processing method for material removal | William Boyd Rogers, Ferdinand Aldas | 2020-03-24 |