Issued Patents 2020
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10817700 | Optical fingerprint recognition chip package and packaging method | Guoliang Xie, Hanqing Hu | 2020-10-27 |
| 10763293 | Image sensing chip package and image sensing chip packaging method | — | 2020-09-01 |
| 10685917 | Semiconductor device and manufacture method of the same | — | 2020-06-16 |
| 10680033 | Chip packaging method and chip package | — | 2020-06-09 |
| 10659297 | Negotiation mode processing method and intelligent network device | Fei Liu, Dapeng Chen, Jinli Du | 2020-05-19 |
| 10541264 | Package-on-package structure and package-on-package method | — | 2020-01-21 |
| 10541262 | Image sensing chip packaging structure and packaging method | Zhuowei Wang, Guoliang Xie | 2020-01-21 |
| 10541186 | Chip package and chip packaging method | Guoliang Xie, Hanqing Hu | 2020-01-21 |
| 10529758 | Packaging method and packaging structure | Qiong Yu, Wei-Chung Wang | 2020-01-07 |