HH

Hanqing Hu

CC China Wafer Level Csp Co.: 2 patents #3 of 6Top 50%
Overall (2020): #170,144 of 565,922Top 35%
2
Patents 2020

Issued Patents 2020

Showing 1–2 of 2 patents

Patent #TitleCo-InventorsDate
10817700 Optical fingerprint recognition chip package and packaging method Zhiqi Wang, Guoliang Xie 2020-10-27
10541186 Chip package and chip packaging method Zhiqi Wang, Guoliang Xie 2020-01-21