GX

Guoliang Xie

CC China Wafer Level Csp Co.: 3 patents #2 of 6Top 35%
Overall (2020): #89,547 of 565,922Top 20%
3
Patents 2020

Issued Patents 2020

Showing 1–3 of 3 patents

Patent #TitleCo-InventorsDate
10817700 Optical fingerprint recognition chip package and packaging method Zhiqi Wang, Hanqing Hu 2020-10-27
10541186 Chip package and chip packaging method Zhiqi Wang, Hanqing Hu 2020-01-21
10541262 Image sensing chip packaging structure and packaging method Zhiqi Wang, Zhuowei Wang 2020-01-21