Issued Patents 2020
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10863631 | Layer stack of component carrier material with embedded components and common high temperature robust dielectric structure | Johannes Stahr, Mario Schober | 2020-12-08 |
| 10779413 | Method of embedding a component in a printed circuit board | Andreas Zluc, Gregor Langer, Johannes Stahr | 2020-09-15 |
| 10709023 | Placement of component in circuit board intermediate product by flowable adhesive layer on carrier substrate | Gerald Weidinger, Andreas Zluc | 2020-07-07 |